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Maxim Integrated Products Inc   (MXIM)
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Maxim Integrated Products Inc 's Suppliers Performance

MXIM's Supply Chain

 
MXIM Costs vs Sales of Suppliers Growth Maxim Integrated Products Inc 's Suppliers recorded increase in sales by 18.61 % year on year in Q2 2021, sequentially sales grew by 6.33 %, Maxim Integrated Products Inc 's cost of sales deteriorated by % year on year, sequentially cost of sales grew by 6.16 % in Q2.

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Maxim Integrated Products Inc 's Suppliers recorded increase in sales by 18.61 % year on year in Q2 2021, sequentially sales grew by 6.33 %, Maxim Integrated Products Inc recorded increase in cost of sales by 28.87 % year on year, sequentially cost of sales grew by 6.16 % in Q2.

More on MXIM Suppliers




Maxim Integrated Products Inc 's Comment on Supply Chain


We utilize our own wafer fabrication facilities as well as third party foundries for the production of our wafers. The majority of processed wafers are subject to parametric and functional testing at our facilities. The broad range of products demanded by the analog integrated circuit market requires multiple manufacturing process technologies. As a result, many different process technologies are currently used for wafer fabrication of our products. Historically, wafer fabrication of analog integrated circuits has not required state-of-the-art processing equipment, although newer processes do utilize and require such state-of-the-art facilities and equipment. In addition, hybrid and module products are manufactured using a complex multi-chip technology featuring thin-film, laser-trimmed resistors and other active or passive components. We are expanding our internal and external manufacturing and test capacity to meet our future technology requirements.

A majority of our own wafer production occurred at one of our three owned wafer fabrication facilities at Beaverton, Oregon, San Jose, California and San Antonio, Texas.

We entered into a supply agreement with Seiko Epson Corporation (“Epson”). In fiscal year 2010, we entered into a supply agreement with Powerchip Technology Corporation (“Powerchip”) and Maxchip Electronics Corp. (“Maxchip”) to provide 300mm and 200mm wafer capacity, respectively. Under these agreements, partner foundries (Epson, Powerchip and Maxchip) have manufactured some of the wafers required for our mixed-signal semiconductor products. These products are manufactured under rights and licenses using our proprietary technology at Epson's fabrication facility located in Sakata, Japan and at Powerchip and Maxchip's fabrication facilities in Hsinchu, Taiwan.

Once wafer manufacturing has been completed, wafers may be sorted in order to determine which integrated circuits on each wafer are functional and which are defective. We currently perform the majority of wafer sorting, final testing and shipping activities at two facilities, located in Cavite, the Philippines and Chonburi Province, Thailand, although we also utilize independent subcontractors for some wafer sorting.

Where required, our wafer bump manufacturing facility located in Dallas, Texas is used to process wafers for products that utilize chip scale packaging (“CSP”) also known as wafer level packaging (“WLP”). CSP or WLP enables integrated circuits to be attached directly to a printed circuit board without the use of a traditional plastic package. In addition, we utilize independent subcontractors to perform wafer bump manufacturing to the extent we do not have the internal capacity or capabilities to perform such services. With the introduction of 300mm wafers into our manufacturing network, we have enabled subcontractors located in Taiwan to perform wafer bumping and testing of these wafers.

Integrated circuit assembly is performed by foreign assembly subcontractors, located in China, Japan, Malaysia, the Philippines, Taiwan, Thailand, Singapore and South Korea, where wafers are separated into individual integrated circuits and assembled into a variety of packages.

After assembly has been completed, the majority of the assembled product is shipped back to our facilities located in Cavite, the Philippines or Chonburi Province, Thailand, where the packaged integrated circuits undergo final testing and preparation for customer shipment. In addition, we utilize independent subcontractors to perform final testing.

We currently perform substantially all of our module assembly operations in our facility in Batangas, the Philippines. Our Philippines facility also performs wafer singulation and tape-and-reel of bumped (CSP or WLP) wafers.

The majority of our finished products ship directly from either Cavite, the Philippines or Chonburi Province, Thailand to customers worldwide or to other Company locations for sale to end-customers or distributors.


Maxim Integrated Products Inc 's Comment on Supply Chain


We utilize our own wafer fabrication facilities as well as third party foundries for the production of our wafers. The majority of processed wafers are subject to parametric and functional testing at our facilities. The broad range of products demanded by the analog integrated circuit market requires multiple manufacturing process technologies. As a result, many different process technologies are currently used for wafer fabrication of our products. Historically, wafer fabrication of analog integrated circuits has not required state-of-the-art processing equipment, although newer processes do utilize and require such state-of-the-art facilities and equipment. In addition, hybrid and module products are manufactured using a complex multi-chip technology featuring thin-film, laser-trimmed resistors and other active or passive components. We are expanding our internal and external manufacturing and test capacity to meet our future technology requirements.

A majority of our own wafer production occurred at one of our three owned wafer fabrication facilities at Beaverton, Oregon, San Jose, California and San Antonio, Texas.

We entered into a supply agreement with Seiko Epson Corporation (“Epson”). In fiscal year 2010, we entered into a supply agreement with Powerchip Technology Corporation (“Powerchip”) and Maxchip Electronics Corp. (“Maxchip”) to provide 300mm and 200mm wafer capacity, respectively. Under these agreements, partner foundries (Epson, Powerchip and Maxchip) have manufactured some of the wafers required for our mixed-signal semiconductor products. These products are manufactured under rights and licenses using our proprietary technology at Epson's fabrication facility located in Sakata, Japan and at Powerchip and Maxchip's fabrication facilities in Hsinchu, Taiwan.

Once wafer manufacturing has been completed, wafers may be sorted in order to determine which integrated circuits on each wafer are functional and which are defective. We currently perform the majority of wafer sorting, final testing and shipping activities at two facilities, located in Cavite, the Philippines and Chonburi Province, Thailand, although we also utilize independent subcontractors for some wafer sorting.

Where required, our wafer bump manufacturing facility located in Dallas, Texas is used to process wafers for products that utilize chip scale packaging (“CSP”) also known as wafer level packaging (“WLP”). CSP or WLP enables integrated circuits to be attached directly to a printed circuit board without the use of a traditional plastic package. In addition, we utilize independent subcontractors to perform wafer bump manufacturing to the extent we do not have the internal capacity or capabilities to perform such services. With the introduction of 300mm wafers into our manufacturing network, we have enabled subcontractors located in Taiwan to perform wafer bumping and testing of these wafers.

Integrated circuit assembly is performed by foreign assembly subcontractors, located in China, Japan, Malaysia, the Philippines, Taiwan, Thailand, Singapore and South Korea, where wafers are separated into individual integrated circuits and assembled into a variety of packages.

After assembly has been completed, the majority of the assembled product is shipped back to our facilities located in Cavite, the Philippines or Chonburi Province, Thailand, where the packaged integrated circuits undergo final testing and preparation for customer shipment. In addition, we utilize independent subcontractors to perform final testing.

We currently perform substantially all of our module assembly operations in our facility in Batangas, the Philippines. Our Philippines facility also performs wafer singulation and tape-and-reel of bumped (CSP or WLP) wafers.

The majority of our finished products ship directly from either Cavite, the Philippines or Chonburi Province, Thailand to customers worldwide or to other Company locations for sale to end-customers or distributors.



MXIM's Suppliers Net Income grew by MXIM's Suppliers Net margin grew in Q2 to
39.49 % 18.63 %


Maxim Integrated Products Inc 's Suppliers Sales Growth in Q2 2021 by Industry

Suppliers in Metal Mining Industry      62.53 %
Suppliers in Aerospace & Defense Industry -9.89 %   
Suppliers in Industrial Machinery and Components Industry      43.95 %
Suppliers in Conglomerates Industry      24.72 %
Suppliers in Electric & Wiring Equipment Industry      17.36 %
Suppliers in Medical Equipment & Supplies Industry      109.75 %
Suppliers in Laboratory Analytical Instruments Industry      25.77 %
Suppliers in Professional Services Industry      20.68 %
Suppliers in Communications Equipment Industry      4.41 %
Suppliers in Computer Hardware Industry      3.43 %
Suppliers in Internet Services & Social Media Industry      23.71 %
Suppliers in Electronic Instruments & Controls Industry      29.46 %
Suppliers in Semiconductors Industry      10.33 %
Suppliers in Software & Programming Industry      15.06 %
     
• MXIM Suppliers Valuation • MXIM Segment Rev. Growth • MXIM Segment Inc. Growth • MXIM Suppliers Mgmt. Effect.





MXIM's vs. Suppliers, Data

(Revenue and Income for Trailing 12 Months, in Millions of $, except Employees)



COMPANY NAME MARKET CAP REVENUES INCOME EMPLOYEES
Maxim Integrated Products Inc 28,030 2,633 827 8,250
Ase Technology Holding Co Ltd 33,137 16,986 1,020 0
Applied Materials Inc 132,724 21,628 5,307 14,000
Dover Corp 24,208 7,466 1,699 27,000
International Business Machines Corporation 107,759 74,459 4,766 379,592
Kla Corporation 61,091 7,464 2,726 5,880
Newmont Corp 43,496 12,213 1,761 13,700
Teradyne Inc 27,559 3,577 987 3,900
Freeport mcmoran Inc 54,040 21,176 4,865 35,000
Agilent Technologies inc 45,521 6,142 990 21,400
3m Company 101,146 35,326 5,979 89,800
Intel Corporation 200,949 78,474 21,102 106,700
Lam Research Corporation 93,653 15,754 4,265 7,300
Accenture Plc 232,445 50,533 5,991 275,000
Astronics Corporation 321 435 -32 2,000
Sifco Industries Inc 53 104 7 465
Chase Corporation 963 293 45 677
Orbital Energy Group Inc 147 68 -44 0
Bel Fuse Inc 27 512 20 0
Esco Technologies inc 2,251 718 63 3,254
Atomera Incorporated 489 1 -15 16
Torotel Inc 37 26 1 138
Rise Gold Corp 8 2 -3 1
Southern Copper Corp 44,909 10,461 3,167 13,414
Stillwater Mining Co 0 0 0 1,432
Tuanche Ltd 694 51 -25 700
Trilogy Metals Inc 235 -1 172 7
National Instruments Corp 5,567 1,358 22 7,412
Model N Inc 972 193 -30 864
Amkor Technology Inc 5,487 5,785 555 29,300
Formfactor inc 3,293 762 77 1,685
Kulicke and Soffa Industries Inc 3,784 1,518 367 2,778
Park Aerospace Corp 270 52 7 387
Tower Semiconductor Ltd 4,076 1,266 83 5,641
Semiconductor Manufacturing International Corp 223,336 3,360 77 11,385
Viavi Solutions Inc 3,494 1,241 -5 3,500
Xperi Holding Corporation 1,970 1,097 135 700
Kyocera Corp 20,233 13,537 1,045 75,940
Taiwan Semiconductor Manufacturing Co Ltd 632,454 47,694 18,198 45,272
Asml Holding Nv 330,829 15,656 3,980 7,955
SUBTOTAL 2,443,629 457,388 89,325 1,194,195


       
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