We are a pure-play independent specialty foundry dedicated to the manufacture
of semiconductors. Typically, pure-play foundries do not offer products of their
own, but focus on producing integrated circuits, or ICs, based on the design
specifications of their customers. We manufacture semiconductors for our customers
primarily based on third party designs. We currently offer the process manufacture
geometries of 0.35, 0.50, 0.55, 0.60, 0.80-micron and above on 150-mm wafers
and 0.35, 0.18. 0.16, 0.13 and 0.11-micron on 200-mm wafers and 65 nanometer
and 45 nanometer on 300-mm wafers. We also provide design support and complementary
technical services. ICs manufactured by us are incorporated into a wide range
of products in diverse markets, including consumer electronics, personal computers,
communications, automotive, industrial and medical device products.
We are focused on establishing leading market share in high-growth specialized
markets by providing our customers with high-value wafer foundry services. We
manufacture standard analog complementary metal oxide semiconductor (“CMOS”)
process technology, which is a widely used method of producing ICs, and we specialize
in specific technologies including CMOS image sensors, wireless antenna switch
Silicon-on-Insulator (SOI), mixed-signal, radio frequency CMOS (RFCMOS), bipolar
CMOS (BiCMOS), and silicon-germanium BiCMOS (SiGe BiCMOS or SiGe), high voltage
CMOS, radio frequency identification (RFID) technologies, MEMS and power management.
To better serve our customers, we have developed and are continuously expanding
our technology offerings in these fields. Through our experience and expertise
gained during twenty five years of operation, we differentiate ourselves by
creating a high level of value for our clients through innovative technological
processes, design and engineering support, competitive manufacturing indices,
and dedicated customer service.
Tower was founded in 1993, with the acquisition of National Semiconductor’s
150-mm wafer fabrication facility located in Migdal Haemek, Israel, and commenced
operations as an independent foundry. Since then, we have significantly upgraded
our Fab 1 facility, equipment, capacity and technological capabilities with
process geometries ranging from 1.0-micron to 0.35-micron and enhanced our process
technologies to include CMOS image sensors, embedded flash, advanced analog,
RF (radio frequency) and mixed-signal technologies. Recently, we integrated
advanced single Poly NVM into the Fab 1 process flows and are currently in the
process of evaluating the development of GaN technological platform (GaN on
Si).
In 2003, we commenced production in Fab 2, a wafer fabrication facility we established
in Migdal Haemek, Israel. Fab 2 supports geometries ranging from 0.35 to 0.13-micron,
using advanced CMOS technology, including CMOS image sensors, embedded flash,
advanced analog, RF (radio frequency), and specifically RF switches on SOI,
power platforms and mixed-signal technologies.
In September 2008, we merged with Jazz. Jazz focuses on specialty process technologies
for the manufacture of analog and mixed-signal semiconductor devices, and supports
geometries ranging from 0.50 to 0.13-micron. Jazzs specialty process technologies
include advanced analog, radio frequency, high voltage, bipolar, SOI and silicon
germanium bipolar, complementary metal oxide (“SiGe”) semiconductor
processes. ICs manufactured by Jazz are incorporated into a wide range of products,
including cellular phones, wireless local area networking devices, digital TVs,
set-top boxes, gaming devices, switches, routers and broadband modems. Jazz
operates Fab 3 located in Newport Beach, California, US.
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