Maxim Integrated Products Inc's Suppliers recorded an increase in sales by 18.64 % year on year in Q4 2021, sequentially sales grew by 6.74 %, Maxim Integrated Products Inc recorded an increase in cost of sales by 28.87 % year on year, sequentially cost of sales grew by 6.16 % in Q4.
Maxim Integrated Products Inc's Suppliers recorded an increase in sales by 18.64 % year on year in Q4 2021, sequentially sales grew by 6.74 %, Maxim Integrated Products Inc recorded increase in cost of sales by 28.87 % year on year, sequentially cost of sales grew by 6.16 % in Q4.
Maxim Integrated Products Inc's Comment on Supply Chain
We utilize our own wafer fabrication facilities as well as third party foundries
for the production of our wafers. The majority of processed wafers are subject
to parametric and functional testing at our facilities. The broad range of products
demanded by the analog integrated circuit market requires multiple manufacturing
process technologies. As a result, many different process technologies are currently
used for wafer fabrication of our products. Historically, wafer fabrication of
analog integrated circuits has not required state-of-the-art processing equipment,
although newer processes do utilize and require such state-of-the-art facilities
and equipment. In addition, hybrid and module products are manufactured using
a complex multi-chip technology featuring thin-film, laser-trimmed resistors and
other active or passive components. We are expanding our internal and external
manufacturing and test capacity to meet our future technology requirements.
A majority of our own wafer production occurred at one of our three owned wafer
fabrication facilities at Beaverton, Oregon, San Jose, California and San Antonio,
Texas.
We entered into a supply agreement with Seiko Epson Corporation (“Epson”).
In fiscal year 2010, we entered into a supply agreement with Powerchip Technology
Corporation (“Powerchip”) and Maxchip Electronics Corp. (“Maxchip”)
to provide 300mm and 200mm wafer capacity, respectively. Under these agreements,
partner foundries (Epson, Powerchip and Maxchip) have manufactured some of the
wafers required for our mixed-signal semiconductor products. These products
are manufactured under rights and licenses using our proprietary technology
at Epsons fabrication facility located in Sakata, Japan and at Powerchip and
Maxchips fabrication facilities in Hsinchu, Taiwan.
Once wafer manufacturing has been completed, wafers may be sorted in order
to determine which integrated circuits on each wafer are functional and which
are defective. We currently perform the majority of wafer sorting, final testing
and shipping activities at two facilities, located in Cavite, the Philippines
and Chonburi Province, Thailand, although we also utilize independent subcontractors
for some wafer sorting.
Where required, our wafer bump manufacturing facility located in Dallas, Texas
is used to process wafers for products that utilize chip scale packaging (“CSP”)
also known as wafer level packaging (“WLP”). CSP or WLP enables
integrated circuits to be attached directly to a printed circuit board without
the use of a traditional plastic package. In addition, we utilize independent
subcontractors to perform wafer bump manufacturing to the extent we do not have
the internal capacity or capabilities to perform such services. With the introduction
of 300mm wafers into our manufacturing network, we have enabled subcontractors
located in Taiwan to perform wafer bumping and testing of these wafers.
Integrated circuit assembly is performed by foreign assembly subcontractors,
located in China, Japan, Malaysia, the Philippines, Taiwan, Thailand, Singapore
and South Korea, where wafers are separated into individual integrated circuits
and assembled into a variety of packages.
After assembly has been completed, the majority of the assembled product is
shipped back to our facilities located in Cavite, the Philippines or Chonburi
Province, Thailand, where the packaged integrated circuits undergo final testing
and preparation for customer shipment. In addition, we utilize independent subcontractors
to perform final testing.
We currently perform substantially all of our module assembly operations in
our facility in Batangas, the Philippines. Our Philippines facility also performs
wafer singulation and tape-and-reel of bumped (CSP or WLP) wafers.
The majority of our finished products ship directly from either Cavite, the
Philippines or Chonburi Province, Thailand to customers worldwide or to other
Company locations for sale to end-customers or distributors.
Maxim Integrated Products Inc's Comment on Supply Chain
We utilize our own wafer fabrication facilities as well as third party foundries
for the production of our wafers. The majority of processed wafers are subject
to parametric and functional testing at our facilities. The broad range of products
demanded by the analog integrated circuit market requires multiple manufacturing
process technologies. As a result, many different process technologies are currently
used for wafer fabrication of our products. Historically, wafer fabrication of
analog integrated circuits has not required state-of-the-art processing equipment,
although newer processes do utilize and require such state-of-the-art facilities
and equipment. In addition, hybrid and module products are manufactured using
a complex multi-chip technology featuring thin-film, laser-trimmed resistors and
other active or passive components. We are expanding our internal and external
manufacturing and test capacity to meet our future technology requirements.
A majority of our own wafer production occurred at one of our three owned wafer
fabrication facilities at Beaverton, Oregon, San Jose, California and San Antonio,
Texas.
We entered into a supply agreement with Seiko Epson Corporation (“Epson”).
In fiscal year 2010, we entered into a supply agreement with Powerchip Technology
Corporation (“Powerchip”) and Maxchip Electronics Corp. (“Maxchip”)
to provide 300mm and 200mm wafer capacity, respectively. Under these agreements,
partner foundries (Epson, Powerchip and Maxchip) have manufactured some of the
wafers required for our mixed-signal semiconductor products. These products
are manufactured under rights and licenses using our proprietary technology
at Epsons fabrication facility located in Sakata, Japan and at Powerchip and
Maxchips fabrication facilities in Hsinchu, Taiwan.
Once wafer manufacturing has been completed, wafers may be sorted in order
to determine which integrated circuits on each wafer are functional and which
are defective. We currently perform the majority of wafer sorting, final testing
and shipping activities at two facilities, located in Cavite, the Philippines
and Chonburi Province, Thailand, although we also utilize independent subcontractors
for some wafer sorting.
Where required, our wafer bump manufacturing facility located in Dallas, Texas
is used to process wafers for products that utilize chip scale packaging (“CSP”)
also known as wafer level packaging (“WLP”). CSP or WLP enables
integrated circuits to be attached directly to a printed circuit board without
the use of a traditional plastic package. In addition, we utilize independent
subcontractors to perform wafer bump manufacturing to the extent we do not have
the internal capacity or capabilities to perform such services. With the introduction
of 300mm wafers into our manufacturing network, we have enabled subcontractors
located in Taiwan to perform wafer bumping and testing of these wafers.
Integrated circuit assembly is performed by foreign assembly subcontractors,
located in China, Japan, Malaysia, the Philippines, Taiwan, Thailand, Singapore
and South Korea, where wafers are separated into individual integrated circuits
and assembled into a variety of packages.
After assembly has been completed, the majority of the assembled product is
shipped back to our facilities located in Cavite, the Philippines or Chonburi
Province, Thailand, where the packaged integrated circuits undergo final testing
and preparation for customer shipment. In addition, we utilize independent subcontractors
to perform final testing.
We currently perform substantially all of our module assembly operations in
our facility in Batangas, the Philippines. Our Philippines facility also performs
wafer singulation and tape-and-reel of bumped (CSP or WLP) wafers.
The majority of our finished products ship directly from either Cavite, the
Philippines or Chonburi Province, Thailand to customers worldwide or to other
Company locations for sale to end-customers or distributors.
MXIM's Suppliers Net Income grew by
MXIM's Suppliers Net margin grew in Q4 to
39.99 %
18.74 %
MXIM's Suppliers Net Income grew by 39.99 %
MXIM's Suppliers Net margin grew in Q4 to 18.74 %
Maxim Integrated Products Inc's Suppliers Sales Growth
in Q4 2021 by Industry
Sources:
Maxim Integrated Products Inc 's official press releases and regulatory filings; CSIMarket.com's supply-chain research; and the financial filings and press releases of other companies cited in this report.
Updated on:
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