Quicklogic's Business Segments
Quicklogic's reported revenue by business segment and by geographic region, quarterly and annual, normalized against the consolidated income statement. Free below: the top 3 rows per table, this quarter and this fiscal year. Subscriber access adds the full segment history and operating income by segment.
Revenue Share by Reportable Segment - FY
- US0%
- New Products0%
- eFPGA IP and Professional Services0%
- Mature Products17.1%
Revenue by Reportable Segment - FY
| Segment | Revenue (Millions) | % of Total |
|---|---|---|
| US | $ 9 | - |
| New Products | $ 9 | - |
| eFPGA IP and Professional Services | $ 9 | - |
Revenue Share by Region - FY
- North America92.4%
- Asia Pacific10.1%
- Europe1.8%
Revenue by Geographic Region - FY
| Region | Revenue (Millions) | % of Total |
|---|---|---|
| North America | $ 4 | 92.4% |
| Asia Pacific | $ 0 | 10.1% |
| Europe | $ 0 | 1.8% |
Revenue by Product & Service Category - FY
- New Products88.6%
- eFPGA IP and Professional Services86.8%
- Mature Products15.7%
- Hardware Products1.8%
Revenue by Product & Service Category - FY
| Category | Revenue (Millions) | % of Total |
|---|---|---|
| New Products | $ 4 | 88.6% |
| eFPGA IP and Professional Services | $ 4 | 86.8% |
| Mature Products | $ 1 | 15.7% |
Product and service categories are a supplemental disclosure and are not required to sum to consolidated revenue or to the reportable segments above.
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Annual Results
Revenue Share by Reportable Segment - FY
- US0%
- New Products0%
- eFPGA IP and Professional Services0%
- Mature Products17.1%
Revenue by Reportable Segment - FY
| Segment | Revenue (Millions) | % of Total |
|---|---|---|
| US | $ 9 | - |
| New Products | $ 9 | - |
| eFPGA IP and Professional Services | $ 9 | - |
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Description of Quicklogic
QuickLogic Corporation was founded in 1988 and reincorporated in Delaware in 1999. Our vision is to transform the way people and devices interact with each other and their surroundings. Our mission is to provide innovative platforms to successfully enable our customers to develop products that fundamentally change the end-user experience. Specifically, we are a fabless semiconductor company that develops low power System on Chip, or SoCs, Field Programmable Gate Arrays, or FPGAs and embedded FPGA intellectual property. QuickLogic’s products enable smartphone, wearable, hearable, tablet and Internet-of-Things or IoT device Original Equipment Manufacturers, or OEMs, to deliver highly differentiated, immersive user experiences and long battery life for their customers.
Our solutions are created from our new silicon platforms including its EOS™,
ArcticLink® III, PolarPro®3, PolarPro II, PolarPro, and Eclipse II products
(which together comprise our new product category). Our mature products include
primarily pASIC®3 and QuickRAM® as well as programming hardware and
design software. In addition to delivering our own semiconductor solutions,
we have an IP business that licenses our embedded Field Programmable Gate Arrays
or
eFPGA technology for use in other semiconductor companies SoCs. We began delivering
our eFPGA intellectual property or IP product ArcticPro™ in 2017.
Our solutions typically fall into one of three categories: Sensor Processing,
Display and Visual Enhancement, and Smart Connectivity. Our solutions include
a unique combination of our silicon platforms, intellectual property cores,
software drivers, and in some cases, firmware, and application software. All
of our silicon platforms are standard devices and must be programmed to be effective
in a system. Our intellectual property that enables always-on context-aware
sensor applications includes our Flexible Fusion Engine, our Sensor Manager
and Communications Manager technologies as well as IP that (i) improves multimedia
content, such as our Visual Enhancement Engine, or VEE, technology, and Display
Power Optimizer, or DPO, technology; and (ii) implements commonly used mobile
system interfaces, such as Low Voltage Differential Signaling, or LVDS, Mobile
Industry Processor Interface, or MIPI, and Secure Digital Input Output, or SDIO.
We provide complete solutions by first architecting the solution jointly with
our customers or ecosystem partner’s engineering group, selecting the
appropriate solution platform and Proven System Blocks or PSBs, providing custom
logic, integrating the logic, programming the device with the PSBs and/or firmware,
providing software drivers or application software required for the customers
application, and supporting the customer on-site during integration, verification
and testing. In many cases, we may deliver software algorithms that have been
optimized for use in a QuickLogic silicon platform.
We also work with mobile processor manufacturers, sensor manufacturers, and/or voice recognition, sensor fusion and context awareness algorithm developers in the development of reference designs, Qualified Vendor Lists, or QVLs, or “Catalog” solutions. Through reference designs that incorporate our solutions, we believe mobile processor manufacturers, sensor manufacturers, and sensor and voice algorithm companies can expand the served available market for their respective products. Furthermore, should a solution development for a processor manufacturer or sensor and/or sensor algorithm company be applicable to a set of common OEMs or Original Design Manufacturers or ODMs, we can amortize our Research and Development, or R&D, investment over that set of OEMs or ODMs. We call this type of solution a Catalog solution and we are placing a greater emphasis on developing and marketing these types of solutions.
We have changed our manufacturing strategies to reduce the cost of our silicon solution platforms to enable their use in high volume, mass customization products. Our PolarPro 3E, PolarPro II and PolarPro solution platforms include an innovative logic cell architecture, which enables us to deliver twice the programmable logic in the same die size. Our EOS S3 and ArcticLink 3 silicon platforms combine mixed signal physical functions and hard-wired logic alongside programmable logic. Our EOS S3 and ArcticLink III solution platforms are manufactured on an advanced process node where we can benefit from smaller die sizes. We typically implement sophisticated logic blocks and mixed signal functions in hard-wired logic because it is very cost-effective and energy efficient. We use small form factor packages, which are less expensive to manufacture and include smaller pin counts. Reduced pin counts result in lower costs for our customers printed circuit board space and routing. In addition, we have dramatically reduced the time we require to program and test our devices, which has reduced our costs and lowered the capital equipment required to program and test our devices. Furthermore, our SRAM reprogrammable silicon platforms can be programmed in-system by our customers, and therefore we do not incur programming cost, lowering the overall cost of ownership to our customers. We expect to continue to invest in silicon solution platforms and manufacturing technologies that make us cost and power consumption effective for high-volume, battery-powered applications.
We market our solutions primarily to mobile device OEMs and ODMs. We have complete solutions incorporating our EOS S3, ArcticLink III S2, ArcticLink III VX and BX, PolarPro 3, PolarPro II, PolarPro, and Eclipse II solution platforms, packaging, IPs, custom logic, software drivers and our architecture consulting. We partner with target customers in our focus markets to architect and design solutions and to integrate and test our solutions in our customers products. A solution can be based on our programmable technology, which enables customized designs, low power, flexibility, rapid time-to-market, longer time-in-market and lower total cost of ownership. From a mobile system designers perspective, a solutions function is known and complete, and consequently can be designed into systems with a minimum amount of effort and risk. We are capable of providing complete solutions because of our investment in developing the low power IP and software required to implement specific functions, along with sensor software algorithms optimized for our architecture. Because we are involved with our customers at the definition stage of their products, we are able to architect solutions that typically have more than one IP, absorbing more functionality traditionally implemented with multiple ASSPs. In cases where our solution has multiple IPs, significant system performance or battery life improvements can be realized by enabling direct data transfers between the IPs, or by offloading more processing tasks from the host processor to our solution. In some cases, we develop the IPs and either software or firmware ourselves and, in other cases, we utilize third parties to develop the mixed signal physical layers, logic and/or software.
We market our solutions to OEMs and ODMs offering differentiated mobile products, to processor vendors wishing to expand their served available market, and to sensor manufacturers wishing to expand their ecosystems. Our target mobile markets include Tablets, Wearables, Hearables, Smartphones and IoT. Our solutions typically fall into one of three categories: Sensor Processing, Display and Visual Enhancement, or Smart Connectivity.
Our new products are also being used in applications in our traditional markets, such as data communications, instrumentation and test and military-aerospace, where customers value the low power consumption, instant-on, IP security, reliability and fast time-to-market of our products.
The fact that we use our programmable technology to customize these solutions provides two advantages over conventional ASSPs that are based on ASIC technology. Foremost is the fact that our solutions can be tailored for a specific customers requirements. Once we have developed IPs, it is easy to combine IPs with a platforms fixed logic and utilize the remaining programmable logic to provide a unique set of features to a mobile system designer, or to add other functions to the solution, such as Universal Asynchronous Receiver Transmitter, or UARTs, keyboard scanning functions, Serial Peripheral Interface, or SPI, ports, which minimizes system size and cost, and InfraRed Data Association, or IRDA. We are able to develop these solutions from a common solution platform, and partner with system designers to implement a range of solutions, or products, that address different geographic and market requirements. By using programmable technology instead of ASIC technology, we reduce the development time, development risk and total cost of ownership and are able to bring solutions to market far more quickly than other custom silicon alternatives.
By using our silicon platforms, our IPs, our software, and our in-depth architecture knowledge, we can deliver energy efficient custom solutions that blend the benefits of traditional ASSPs with the flexibility, product proliferation, differentiation and low total cost of ownership advantages of programmable logic.
Our product technology consists of five major elements:
First, our programmable logic allows us to hardware customize our platforms. We have two distinct types of programmable logic. We have an SRAM-reprogrammable logic architecture that utilizes a standard CMOS-logic process to meet the specific needs of the sensor and I/O subsystems of mobile devices: very low standby power, low dynamic power, and in-system reprogrammable technology. Our SRAM-reprogrammable logic is the basis of our ArcticPro eFPGA IP Licensing initiative.
We also have our ViaLink programmable logic that uses proprietary and patented technology to meet the specific smart connectivity needs of the Radio Frequency, Memory and Display subsystems of mobile products: non-volatility and instant-on, very low standby power, low dynamic power, small form factor, single chip solutions that power cycle easily and quickly. Hardware customization gives our devices the ability to execute key actions faster than software implementations, and at lower power.
Second, our ArcticLink and EOS S3 solution platforms combine mixed signal physical functions, hard-wired logic and programmable logic on one device. Mixed signal capability supports the trend toward serial connectivity in mobile applications, where designers benefit from lower pin counts, simplified printed circuit board, or PCB, layouts, simplified PCB interconnect and reduced signal noise. Adding hard-wired intellectual property enables us to deliver more logic at lower cost and lower power while the programmable logic allows us to provide solutions that can be rapidly customized to differentiate products, add features and reduce system development costs. This combination of mixed signal, hard-wired logic and programmable logic enables us to deliver low cost, small form factor solutions that can be customized for particular customer or market requirements while lowering the total cost of ownership.
Third, we develop and integrate innovative IP cores, intelligent data processing IP cores, or standard interfaces used in mobile products. We offer:
Sensor Processing IPs such as Flexible Fusion Engine, or FFE, Sensor Manager, or Communications Manager;
Display and Visual Enhancement s such as VEE, DPO or LCD controller interfaces, LVDS and MIPI;
Network IPs such as high speed Universal Asynchronous Receiver/Transmitters, or UARTs, to enable connectivity to Bluetooth devices;
Storage IPs such as Secure Digital High Capacity, or SDHC; and
Other IPs such as I2S, PCM, I2C, IRDA, PWM, and other general purpose interfaces.
Fourth, we develop and optimize a software framework for use in conjunction
with our sensor processing silicon platforms.
Fifth, our unique customer engagement model enables us to develop complete solutions for target customers who wish to bring differentiated, mobile products to market quickly and cost-effectively. We partner with customers to define solutions specific to their requirements, and combine all of the above technologies using one of our solution platforms, proven logic IP cores, custom FPGA logic, software drivers, firmware and application software. We then work with these customers to integrate and test solutions in their systems. The benefit of providing complete solutions is that we effectively become a virtual extension of our customers engineering organization.
Segments
1. IoT and Edge Computing:
QuickLogic provides solutions tailored for IoT applications that require low power consumption, efficient processing capabilities, and real-time data handling. Their products are designed to enable intelligent edge devices capable of analyzing and processing data locally rather than relying solely on cloud services.
2. Consumer Electronics:
The company develops solutions aimed at enhancing consumer devices, including smartphones, tablets, smart speakers, and other portable electronics. QuickLogic focuses on optimizing performance while minimizing power consumption to extend battery life and improve user experience.
3. Wearable Technology:
Given the surge in wearable devices like fitness trackers and smartwatches, QuickLogic offers solutions that support the compact design and low power requirements necessary for such devices without sacrificing functionality or features.
4. Machine Learning & Artificial Intelligence:
QuickLogic’s advancements in machine learning (ML) enable devices to process data intelligently, enhancing functionality in applications such as voice recognition, object detection, and predictive analysis. They provide edge-based ML solutions that operate efficiently on small, low-power devices.
5. Automotive:
Dedicated to supporting automotive applications, QuickLogic develops solutions that focus on safety, connectivity, and ease of use in vehicles. Their products are designed to comply with automotive standards and tailored for various in-car applications.
Products
1. FPGA (Field-Programmable Gate Array):
QuickLogic’s FPGA offerings include customizable hardware solutions that allow customers to tailor functionality for a specific application while also optimizing performance and power consumption. Their FPGAs are often used in IoT devices, communications, and industrial applications.
2. eFPGA (Embedded FPGA):
These products combine the flexibility of FPGAs with the benefits of being embedded in a system-on-chip (SoC). They provide additional customization options for SoCs, enabling developers to redefine their hardware logic even after manufacturing.
3. System-on-Chip (SoC) Solutions:
QuickLogic designs SoCs that integrate various functionalities into a single chip, allowing for compact designs and efficient power consumption. These solutions typically include components for wireless connectivity, processing, and other essential functionalities.
4. Sensor and Connectivity Solutions:
QuickLogic provides integrated solutions that focus on sensor data processing and connectivity options like Bluetooth and Wi-Fi. These products help devices communicate and interact seamlessly within the IoT ecosystem.
5. Software Development Tools:
The company offers a range of software development tools that support their hardware products. This includes design tools for FPGA and SoC development, libraries for machine learning applications, and platforms to facilitate the integration of their solutions into end products.
Services
1. Design and Development Support:
QuickLogic provides comprehensive design support to its customers, including consultation during product design and development. This service is crucial for companies looking to leverage QuickLogics technology effectively.
2. Prototyping Services:
They assist clients in creating prototypes of their applications using QuickLogics solutions, allowing for verification of concepts and testing before full-scale production.
3. Customized Solutions:
Understanding the need for tailored products, QuickLogic offers the ability to customize their hardware solutions to meet the specific requirements of clients, contributing to unique applications in various industries.
4. Technical Support and Training:
Technical support is provided to clients to aid in the integration of QuickLogic products into their systems. In addition, training services are available to help engineering teams understand and utilize the companys offerings effectively.
5. Partnership Programs:
QuickLogic foster partnerships with various ecosystem players, including developers, system integrators, and technology partners, to encourage collaborative innovation. These programs aim to accelerate the adoption of their technologies across diverse markets.
Through its extensive range of segments, products, and services, QuickLogic Corp aims to empower companies in leveraging advanced semiconductor technologies, facilitating the development of next-generation smart devices that tackle modern challenges in efficient and innovative ways.
