Testing Services
Our testing services are rendered to manufacturers and purchasers of semiconductors
and other entities who either lack testing capabilities or whose in-house screening
facilities are insufficient for testing devices in order for them to make sure
that these products meet certain commercial specifications. Customers outsource
their test services either to accommodate fluctuations in output or to benefit
from economies that can be offered by third party service providers.
Our laboratories perform a variety of tests, including stabilization bake,
thermal shock, temperature cycling, mechanical shock, constant acceleration,
gross and fine leak tests, electrical testing, microprocessor equipment contract
cleaning services, static and dynamic burn-in tests, reliability lab services
and vibration testing. We also perform qualification testing, consisting of
intense tests conducted on small samples of output from manufacturers who require
qualification of their processes and devices.
We use our own proprietary equipment for certain burn-in, centrifugal and leak
tests, and commercially available equipment for various other environmental
tests. We conduct the majority of our testing operations in Southeast Asia with
facilities in Singapore, Malaysia, Thailand and China, which have been certified
to the relevant ISO quality management standards.
Manufacturing
We manufacture both front-end and back-end semiconductor test equipment and
related peripherals at our facilities in Singapore and the United States.
Front-End Products
Artic Temperature Controlled Wafer Chucks
Artic Temperature Controlled Wafer Chucks are used for test, characterization
and failure analysis of semiconductor wafers and such other components at accurately
controlled cold and hot temperatures. These systems provide excellent performance
to meet the most demanding customer applications. Several unique mechanical
design features provide excellent mechanical stability under high probing forces
and across temperature ranges.
Wet Process Stations
Wet Process Stations are used for cleaning, rinsing and drying semiconductor
wafers, flat panel display magnetic disks, and other microelectronic substrates.
After the etching or deposition of integrated circuits, wafers are typically
sent through a series of 100 to 300 additional processing steps. At many of
these processing steps, the wafer is washed and dried using Wet Process Stations.
Back-End Products
Autoclaves and HAST (Highly Accelerated Stress Test) Equipment
We manufacture autoclaves, HAST systems and specialized test fixtures. Autoclaves
provide pressurized, saturated vapor (100% relative humidity) test environments
for fast and easy monitoring of integrated circuit manufacturing processes.
HAST systems provide a fast and cost-effective alternative to conventional non-pressurized
temperature and humidity testing.
Burn-in Equipment and Boards
We manufacture burn-in systems, burn-in boards and burn-in board test systems.
Burn-in equipment is used to subject semiconductor devices to elevated temperatures
while testing them electrically to identify early product failures and to assure
long-term reliability. Burn-in boards are used to mount devices during high
temperature environmental stressing tests.
We provide integrated burn-in automation solutions to improve products’
yield, reduce processing downtime and improve efficiency. In addition, we develop
a cooling solution, which is used to cool or maintain the temperature of high
power heat dissipation semiconductor devices.
Component Centrifuges and Leak Detection Equipment
We manufacture centrifuges that perform high speed constant acceleration to
test the mechanical integrity of ceramic and other hermetically sealed semiconductor
devices and electronic parts for high reliability and aerospace applications.
Leak detection equipment is designed to detect leaks in hermetic packaging.
The bubble tester is used for gross leak detection. A visual bubble trail will
indicate when a device is defective.