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Kulicke & Soffa Industries Inc  (KLIC)
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    Sector  Technology    Industry Semiconductors
 
   Industry Semiconductors
   Sector  Technology
 


Kulicke & Soffa Industries Inc Segments

 
 

Business Segments III. Quarter
Revenues
(in millions $)
(Jun 30 2018)
%
(of total Revenues)
III. Quarter
Income
(in millions $)
(Jun 30 2018)
%
(Profit Margin)
Total
268.83 100 % 60.26 22.41 %

• View Income Statement • View Competition by Segment • View Annual Report

Growth rates by Segment III. Quarter
Y/Y Revenue
%
(Jun 30 2018)
Q/Q Revenue
%
III. Quarter
Y/Y Income
%
(Jun 30 2018)
Q/Q Income
%
Total
34.68 % 21.22 % 107.49 % 65.94 %

• View Growth rates • View Competitors Segment Growth • View Market Share

To get more information on Kulicke & Soffa Industries Inc's Total segment. Select each division with the arrow.

  Kulicke & Soffa Industries Inc's

Business Segments Description



Ball bonders

IConnPS PLUS series

Advanced and ultra fine pitch applications

IConnPS ProCu PLUS series

High-end copper wire applications demanding advanced process capability and high productivity

IConnPS MEM PLUS series

Memory applications


ConnXPS PLUS series

Bonder for low-to-medium pin count applications


ConnXPS LED PLUS

LED applications


Wedge bonders

3600PLUS

Power hybrid and automotive modules using either heavy aluminum wire or PowerRibbon®

3700PLUS

Hybrid and automotive modules using thin aluminum wire

PowerFusionPS TL

Power semiconductors using either aluminum wire or PowerRibbon®


PowerFusionPS HL

Smaller power packages using either aluminum wire or PowerRibbon®

AsterionTM

Power hybrid and automotive modules with larger area using heavy and thin aluminum

AsterionTM EV

Extended area for battery bonding and dual lane hybrid module bonding


Advanced Packaging

AT Premier PLUS

Advanced wafer level bonding application

APAMA C2S

Thermo-compression for chip-to-substrate, chip-to-chip and high accuracy flip chip ("HA FC") bonding applications

APAMA C2W

Thermo-compression for chip-to-wafer, HA FC and high density fan-out wafer level packaging ("HD FOWLP") bonding applications

APAMA DA

High performance and productivity die attach bonder for single or stack die bonding

LITEQ 500A

Lithographic stepper for the formation of redistribution layer ("RDL") in FOWLP, fan-in wafer level packaging ("FIWLP") and flip chip ("FC")

LITEQ 500B

Lithographic stepper for the formation of RDL in FOWLP, FIWLP and FC with higher throughput


Hybrid Series

Advanced packages assembly applications requiring high throughput such as flip chip, WLP, FOWLP, embedded die, SiP, package-on-package ("POP"), and modules
Power Series (“PS”)
Standard version
Large area version
Extended large area version




Typical Served Market


Electronics Assembly

iX Series

Advanced Surface Mount Technology ("SMT") applications requiring extremely high output of passive and active components


iFlex Series

Advanced SMT applications requiring multi-lane or line balancing solutions for standard or oddform passive and active components

   

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