Aehr Test Systems's Business Segments

On May 25, 1977, Aehr Test was incorporated in the state of California. We design, produce, and market solutions to decrease testing costs and perform reliability screening, stress testing, burn-in, and cycling on homogeneous and heterogeneous logic and memory semiconductor integrated circuits, sensors, power, and optical devices. These technologies enable parallel testing and burn-in of packaged devices, singulated bare die, or semiconductor devices while they are still in wafer form. The growing automotive, mobility, networking, and telecommunications sectors necessitate semiconductor devices with higher quality and reliability standards.
To meet these needs, device manufacturers are increasing capacity and performing additional testing and burn-in of their products, creating opportunities for Aehr Test products in package and wafer-level testing. Leveraging its expertise as a long-time leading provider of burn-in equipment, and having installed over 2,500 systems worldwide, the Company has developed and introduced several innovative product families, including the ABTSTM and FOXTM family of systems, the WaferPakTM Contactor and the DiePak' Carrier for making electrical and thermal contact with devices under test, and WaferPak Aligners and DiePak Autoloaders for handling and alignment of devices into the corresponding WaferPaks and DiePaks. The ABTS family of packaged part burn-in and test systems can perform test during burn-in of complex devices, such as digital signal processors, microprocessors, microcontrollers, memory and systems-on-a-chip, and offers individual temperature control for high-power advanced logic devices while in a packaged form. The FOX family of systems are parallel test and burn-in systems designed to contact all devices on one or more wafers or panels of devices simultaneously, thus enabling cost effective full wafer parallel test and burn-in. The FOX systems are also used for parallel test and burn-in of singulated die or very small multi-IC modules. The WaferPak Contactor includes a full-wafer probe card for use in testing wafers in FOX systems. The DiePak Carrier is a reusable, temporary package that enables IC manufacturers to perform cost-effective test and burn-in of singulated bare die or very small multi-IC modules.
The FOX-XP test and burn-in system, introduced in July 2016, is designed for devices in wafer, singulated die, and module form that require test and burn-in times typically measured in hours to days. The FOX-XP system can test and burn-in up to 18 wafers at a time. For high reliability applications, such as automotive, mobile devices, networking, telecommunications, sensors, power and solid-state devices, the FOX-XP system is a cost-effective solution for producing tested and burned-in die for use in multi-chip packages. Using Known-Good Die, or KGD, which are fully burned-in and tested die, in multi-chip/heterogeneous packages helps assure the reliability of the final product and lowers costs by increasing the yield of high-cost multi-chip packages. Wafer-level burn-in and test enables lower cost production of KGD for multi-chip modules, 3-D stacked packages and systems-in-a-package. The FOX-P platform has been extended for burn-in and test of small multi-die modules by using DiePak Carriers. The DiePak Carrier with its multi-module sockets and high wattage dissipation capabilities has a capacity of hundreds of die or modules, much higher than the capacity of a traditional burn-in system with traditional single-device sockets and heat sinks. This capability was introduced in March 2017.
Test during burn-in, or TDBI, systems consist of several subsystems: pattern generation and test electronics, control software, network interface and environmental chamber. The test pattern generator allows duplication of most of the functional tests performed by a traditional tester. Pin electronics at each burn-in board, or BIB, position are designed to provide accurate signals to the ICs being tested and detect whether a device is failing the test.

Devices being tested are placed on BIBs and loaded into environmental chambers which typically operate at temperatures from 25 degrees Celsius (77 degrees Fahrenheit) up to 150 degrees Celsius (302 degrees Fahrenheit). Using our optional chambers, our systems can produce temperatures as low as -55 degrees Celsius (-67 degrees Fahrenheit). A single BIB can hold up to several hundred ICs, and a production chamber holds up to 72 BIBs, resulting in thousands of memory or logic devices being tested in a single system.

Aehr Test Systems is a technology company primarily focused on developing and marketing advanced test and burn-in systems for semiconductor devices. They are key players in the burgeoning field of silicon carbide (SiC) and gallium nitride (GaN) technologies, which are increasingly critical for various applications, including automotive and industrial markets. Their product offerings can be categorized into segments that highlight their core competencies in testing and reliability.

Segments

1. Semiconductor Test Equipment:
This segment encompasses the engineering and manufacturing of systems designed to test and ensure the reliability of semiconductor devices. Aehr Test Systems provides a range of products tailored to different scale and technology requirements.

2. Burn-In Test Systems:
These systems are crucial for ensuring that semiconductor products can withstand operational stresses over prolonged periods. Aehrs burn-in systems help in assessing the performance and durability of chips under simulated real-world conditions.

3. Production Test and Qualification:
This segment focuses on high-volume manufacturing environments, enabling the efficient testing of semiconductor devices in a production setting. Aehr’s systems are designed to integrate seamlessly into existing manufacturing processes.

4. Advanced Packaging Solutions:
With the rise of heterogeneous integration and complex semiconductor packaging, Aehr offers solutions that cater specifically to advanced packaging techniques, addressing the testing needs for modern devices that require multi-die configurations.

Products

1. FOX™ Test Systems:
The FOX series is a flagship product line from Aehr Test Systems. These systems are versatile and handle various testing requirements, including burn-in testing and reliability qualification. The FOX systems can be configured for different device types and sizes, supporting testing in both low- and high-volume production.

2. Wafer-Level Test Systems:
These systems are designed for testing semiconductor wafers before they are diced into individual chips. They support high throughput and are essential for ensuring yield and quality in the early stages of semiconductor manufacturing.

3. Die-Level Test Systems:
Aehr’s die-level testers offer high-accuracy performance for individual semiconductor dies. This allows for detailed characterization and testing, ensuring that only the most reliable dies are packaged and sent to customers.

4. Aehr’s Multi-Site Test Solutions:
These solutions allow simultaneous testing of multiple devices in parallel, improving throughput and effectiveness in semiconductor testing. This product line supports a variety of configurations suitable for various semiconductor technologies.

Services

1. Customer Support and Maintenance:
Aehr Test Systems provides comprehensive customer support services, ensuring that clients can maintain and optimize their testing systems. This includes preventive maintenance, troubleshooting, and technical support.

2. Training and Consulting:
The company offers training programs for its products, helping customers understand and utilize the test systems effectively. Consultant services are also available to assist clients in developing custom testing solutions tailored to their specific needs.

3. Applications Engineering:
Aehr has a team of applications engineers who work alongside customers to help design test strategies, optimize testing techniques, and ensure the adaptiveness of their systems to meet evolving market demands.

4. System Integration Services:
Aehr works alongside customers to ensure that their test and burn-in systems are seamlessly integrated into existing manufacturing workflows. This service might include software integration, customization of equipment, and setup of automated systems.

Conclusion

Aehr Test Systems serves a vital role in the semiconductor industry by providing advanced testing solutions that cater to both traditional and emerging technologies. Their comprehensive product offerings and robust customer support services position them as key partners to semiconductor manufacturers aiming to improve product reliability and efficiency. The companys focus on innovation and customer satisfaction underscores its commitment to delivering high-performance testing solutions that meet the evolving demands of the semiconductor landscape.