Revenues of Rockley Photonics Holdings Limited's Suppliers, deteriorated by -0.34 % compared to the same quarter a year ago, sequentially sales grew by 36.07 %, Rockley Photonics Holdings Limited's cost of sales deteriorated by 0 % year on year, relative to one quarter ago cost of sales fell by -65.73 % in Q4.
Rockley Photonics Holdings Limited's Suppliers realized a deteriorated in sales by -0.34 % compared to the same quarter a year ago, sequentially sales grew by 36.07 %, Rockley Photonics Holdings Limited's cost of sales deteriorated by 0 % year on year, compare to one quarter ago cost of sales fell by -65.73 % in Q4.
Rockley Photonics Holdings Limited's Comment on Supply Chain
Raw Materials and Wafer Supply: The starting raw materials (SOI wafers) for our silicon photonics have been customized by world leading silicon providers for the Rockley proprietary specification. For the active III-V components, we have arrangements in place with the world?s leading epitaxial wafer supplier. We also have volume ready suppliers for commercial off-the shelf-components (?COTS?) that go into the visible sensing and the overall module.
Wafer Fabrication: Our SOI wafers are converted into fully processed silicon photonics PIC wafers at Skywater. The process used by SW is wholly owned by Rockley and licensed for use by SW only in Rockley products. The process design kit (?PDK?) for this process is developed and maintained by us and constitutes our intellectual property.
For the III-V active components, epitaxial materials are processed into finished wafers at a world leading dedicated III-V foundry making detectors, lasers and LEDs using state-of-the-art wafer-scale levels of automation. We have adapted the base process technology from this foundry to incorporate the previously discussed elements that allow for ease of integration into our platform and ease of manufacturing. These elements are exclusively for use in Rockley products.
Finally, for ASIC manufacturing, we use a standard process node and PDK provided to us by Taiwan Semiconductor Manufacturing Company, Limited. While the manufacturing process is widely used in high volume (good for product economics), the design know-how belongs to Rockley. The custom ASIC matches our silicon photonics platform optimally for low noise, low power and high level of integration.
Chipset and module integration: The chipset integration of the III-V active components into the silicon PICs is done at wafer scale and using passive alignment techniques that are uniquely enabled in our platform. Furthermore, we have ensured that the III-V components are in arrays of devices (reduces amount of alignment and integration activities) and on pretested known good die (?KGD?) which ensures very high compounded yields. The process intellectual property (?IP?) is developed and owned by Rockley and the integration is currently done in the UK at pilot production volumes, with plans to outsource higher volume in the future.
Rockley Photonics Holdings Limited's Comment on Supply Chain
Raw Materials and Wafer Supply: The starting raw materials (SOI wafers) for our silicon photonics have been customized by world leading silicon providers for the Rockley proprietary specification. For the active III-V components, we have arrangements in place with the world?s leading epitaxial wafer supplier. We also have volume ready suppliers for commercial off-the shelf-components (?COTS?) that go into the visible sensing and the overall module.
Wafer Fabrication: Our SOI wafers are converted into fully processed silicon photonics PIC wafers at Skywater. The process used by SW is wholly owned by Rockley and licensed for use by SW only in Rockley products. The process design kit (?PDK?) for this process is developed and maintained by us and constitutes our intellectual property.
For the III-V active components, epitaxial materials are processed into finished wafers at a world leading dedicated III-V foundry making detectors, lasers and LEDs using state-of-the-art wafer-scale levels of automation. We have adapted the base process technology from this foundry to incorporate the previously discussed elements that allow for ease of integration into our platform and ease of manufacturing. These elements are exclusively for use in Rockley products.
Finally, for ASIC manufacturing, we use a standard process node and PDK provided to us by Taiwan Semiconductor Manufacturing Company, Limited. While the manufacturing process is widely used in high volume (good for product economics), the design know-how belongs to Rockley. The custom ASIC matches our silicon photonics platform optimally for low noise, low power and high level of integration.
Chipset and module integration: The chipset integration of the III-V active components into the silicon PICs is done at wafer scale and using passive alignment techniques that are uniquely enabled in our platform. Furthermore, we have ensured that the III-V components are in arrays of devices (reduces amount of alignment and integration activities) and on pretested known good die (?KGD?) which ensures very high compounded yields. The process intellectual property (?IP?) is developed and owned by Rockley and the integration is currently done in the UK at pilot production volumes, with plans to outsource higher volume in the future.
RKLY's Suppliers Net profit fell by
RKLY's Suppliers Net margin fell in Q4 to
-38.88 %
16.47 %
RKLY's Suppliers Net profit fell by -38.88 %
RKLY's Suppliers Net margin fell in Q4 to 16.47 %
Rockley Photonics Holdings Limited's Suppliers Sales Growth
in Q4 2022 by Industry
Sources:
Rockley Photonics Holdings Limited's official press releases and regulatory filings; CSIMarket.com's supply-chain research; and the financial filings and press releases of other companies cited in this report.
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