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Broadcom Inc.  (AVGO)
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Broadcom's Suppliers Performance

AVGO's Supply Chain

 
AVGO Costs vs Sales of Suppliers Growth Broadcom's Suppliers recorded increase in sales by 3.79 % year on year in Q2 2019, sequentially sales grew by 30.82 %, Broadcom's cost of sales deteriorated by % year on year, sequentially cost of sales grew by 2.18 % in Q2.

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Broadcom's Suppliers recorded increase in sales by 3.79 % year on year in Q2 2019, sequentially sales grew by 30.82 %, Broadcom recorded increase in cost of sales by 1.51 % year on year, sequentially cost of sales grew by 2.18 % in Q2.

More on AVGO Suppliers




Broadcom's Comment on Supply Chain


Wafer Fabrication

We depend on multiple foundry subcontractors located in Asia to manufacture a majority of our products. Our key silicon foundries are:

Taiwan Semiconductor Manufacturing Corporation, or TSMC, in Taiwan;
United Microelectronics Corporation in Singapore and Taiwan;
Semiconductor Manufacturing International Corporation in China; and
GlobalFoundries, Inc. (formerly Chartered Semiconductor Manufacturing) in Singapore and Germany.

By subcontracting manufacturing, we focus resources on design and test applications where we believe we have greater competitive advantages. This strategy also avoids the high capital cost of owning and operating semiconductor wafer fabrication facilities.

Most of our products are manufactured using complementary metal oxide semiconductor, or CMOS, process technology. Our products are currently fabricated on a variety of processes ranging from 500 nanometers to 28 nanometers. We generally evaluate the benefits of migrating to smaller geometry process technologies based on the benefits in performance, power and/or cost.

Assembly and Test

Our products are tested at either the wafer level and/or the packaged finished products level. Our product testing is conducted by independent foundries, and independent test subcontractors. The die are assembled into finished products by independent assembly and package subcontractors. A majority of our test and assembly is performed by the following independent subcontractors:

Advanced Semiconductor Engineering (ASE) in Singapore, China and Taiwan (test, assembly and packaging);
Siliconware Precision in Taiwan (test, assembly and packaging);
United Test and Assembly Center in Singapore, China and Thailand (test, assembly and packaging);
Amkor in Korea, Philippines, Taiwan and China (assembly and packaging only); and
STATSChipPAC in Singapore, Korea, Malaysia and China (test, assembly and packaging);

The lack of diversity of suppliers could also drive increased wafer prices, adversely affect our results of operations, including our product gross margins.

We do not have long-term agreements with any of our direct or indirect suppliers, including our manufacturing, assembly or test subcontractors. We typically procure services from these suppliers on a per order basis. In the event our third-party foundry subcontractors experience a disruption or limitation of manufacturing, assembly or testing capacity, we may not be able to obtain alternative manufacturing, assembly and testing services in a timely manner, or at all. Furthermore, our foundries must have new manufacturing processes qualified if there is a disruption in an existing process, which could be time-consuming. We could experience significant delays in product shipments if we are required to find alternative manufacturers, assemblers or testers for our products. We are continuing to develop relationships with additional third-party subcontractors to assemble and test our products.


Broadcom's Comment on Supply Chain


Wafer Fabrication

We depend on multiple foundry subcontractors located in Asia to manufacture a majority of our products. Our key silicon foundries are:

Taiwan Semiconductor Manufacturing Corporation, or TSMC, in Taiwan;
United Microelectronics Corporation in Singapore and Taiwan;
Semiconductor Manufacturing International Corporation in China; and
GlobalFoundries, Inc. (formerly Chartered Semiconductor Manufacturing) in Singapore and Germany.

By subcontracting manufacturing, we focus resources on design and test applications where we believe we have greater competitive advantages. This strategy also avoids the high capital cost of owning and operating semiconductor wafer fabrication facilities.

Most of our products are manufactured using complementary metal oxide semiconductor, or CMOS, process technology. Our products are currently fabricated on a variety of processes ranging from 500 nanometers to 28 nanometers. We generally evaluate the benefits of migrating to smaller geometry process technologies based on the benefits in performance, power and/or cost.

Assembly and Test

Our products are tested at either the wafer level and/or the packaged finished products level. Our product testing is conducted by independent foundries, and independent test subcontractors. The die are assembled into finished products by independent assembly and package subcontractors. A majority of our test and assembly is performed by the following independent subcontractors:

Advanced Semiconductor Engineering (ASE) in Singapore, China and Taiwan (test, assembly and packaging);
Siliconware Precision in Taiwan (test, assembly and packaging);
United Test and Assembly Center in Singapore, China and Thailand (test, assembly and packaging);
Amkor in Korea, Philippines, Taiwan and China (assembly and packaging only); and
STATSChipPAC in Singapore, Korea, Malaysia and China (test, assembly and packaging);

The lack of diversity of suppliers could also drive increased wafer prices, adversely affect our results of operations, including our product gross margins.

We do not have long-term agreements with any of our direct or indirect suppliers, including our manufacturing, assembly or test subcontractors. We typically procure services from these suppliers on a per order basis. In the event our third-party foundry subcontractors experience a disruption or limitation of manufacturing, assembly or testing capacity, we may not be able to obtain alternative manufacturing, assembly and testing services in a timely manner, or at all. Furthermore, our foundries must have new manufacturing processes qualified if there is a disruption in an existing process, which could be time-consuming. We could experience significant delays in product shipments if we are required to find alternative manufacturers, assemblers or testers for our products. We are continuing to develop relationships with additional third-party subcontractors to assemble and test our products.



AVGO's Suppliers Net profit fell by AVGO's Suppliers Net margin fell in Q2 to
-29.46 % 13 %


Broadcom Inc.'s Suppliers Sales Growth in Q2 2019 by Industry

Suppliers in Chemical Manufacturing Industry -0.95 %   
Suppliers in Metal Mining Industry -12.07 %   
Suppliers in Miscellaneous Fabricated Products Industry -1.65 %   
Suppliers in Aerospace & Defense Industry -9.83 %   
Suppliers in Miscellaneous Manufacturing Industry      3.53 %
Suppliers in Industrial Machinery and Components Industry      114.98 %
Suppliers in Conglomerates Industry -2.61 %   
Suppliers in Auto & Truck Parts Industry -9.85 %   
Suppliers in Electric & Wiring Equipment Industry -10.04 %   
Suppliers in Communications Equipment Industry -12.18 %   
Suppliers in Computer Networks Industry -50.57 %   
Suppliers in Internet Services & Social Media Industry -12.38 %   
Suppliers in Electronic Instruments & Controls Industry      7.07 %
Suppliers in Scientific & Technical Instruments Industry      12.97 %
Suppliers in Semiconductors Industry -6.17 %   
Suppliers in Software & Programming Industry      0.18 %
     
• AVGO Suppliers Valuation • AVGO Segment Rev. Growth • AVGO Segment Inc. Growth • AVGO Suppliers Mgmt. Effect.





AVGO's vs. Suppliers, Data

(Revenue and Income for Trailing 12 Months, in Millions of $, except Employees)



COMPANY NAME TICKER MARKET CAP REVENUES INCOME EMPLOYEES
Broadcom Inc. AVGO 117,734 22,265 2,992 -
Agilent Technologies, Inc. A 23,937 5,055 1,126 21,400
Applied Optoelectronics, Inc. AAOI 210 209 -45 3,054
Applied Materials Inc AMAT 49,577 14,868 2,884 14,000
Applied Micro Circuits Corp AMCC 0 0 0 507
Advanced Micro Devices Inc AMD 34,068 6,587 334 10,671
Amkor Technology, Inc. AMKR 2,333 4,298 9 29,300
Air Products & Chemicals Inc APD 47,757 8,935 1,750 19,700
Airgas Inc ARG 0 0 0 17,000
Arris International Plc ARRS 5,851 6,709 90 8,700
Asml Holding Nv ASML 113,544 5,875 1,137 7,955
Ase Technology Holding Co., Ltd. ASX 21,201 12,123 896 0
Atomera Inc ATOM 57 0 -14 16
Astronics Corporation ATRO 989 813 114 2,000
Avx Corp AVX 2,649 1,739 271 10,200
Barnes Group Inc B 2,664 1,502 150 5,036
Bel Fuse Inc BELFA 25 542 19 7,971
Cooper Industries, Ltd. CBE 0 0 0 0
Chase Corp CCF 976 287 34 677
Cabot Microelectronics Corporation CCMP 4,134 801 116 1,179
Cemtrex Inc CETX 3 81 -14 577
Cts Corporation CTS 1,052 477 51 322
Cui Global, Inc. CUI 21 98 -15 352
Danaher Corp DHR 100,152 20,253 2,476 71,000
Dover Corp DOV 14,126 6,808 603 27,000
Dow Chemical Co DOW 0 57,177 1,057 53,000
Dsw Inc. DSW 1,852 3,060 37 0
Emcore Corp EMKR 82 88 -27 364
Eastman Chemical Co EMN 10,169 9,907 1,053 15,000
Esco Technologies Inc. ESE 2,078 808 85 3,254
Freeport-mcmoran Inc. FCX 13,814 15,930 1,044 35,000
Finisar Corp FNSR 2,834 1,243 -43 13,000
Formfactor, Inc. FORM 1,507 -405 105 1,685
Harmonic Inc HLIT 558 379 -28 1,244
Ieh Corp IEHC 50 27 4 160
Ii-vi Inc IIVI 2,195 1,362 108 0
Intel Corporation INTC 238,136 70,386 19,746 106,700
Kla Corp KLAC 26,316 4,569 1,175 5,880
Kulicke & Soffa Industries Inc KLIC 1,530 585 35 2,778
Kmg Chemicals Inc KMG 1,211 466 65 626
Kyocera Corp KYO 20,233 13,537 1,045 75,940
Lear Corp LEA 7,589 20,002 966 136,200
Lam Research Corporation LRCX 154,830 11,077 2,191 7,300
Lightwave Logic, Inc. LWLG 56 0 -6 10
Lsb Industries Inc LXU 158 401 -55 610
Microwave Filter Co Inc MFCO 1 4 0 37
3m Co MMM 95,523 32,131 4,919 89,800
Model N, Inc. MODN 920 141 -17 864
Molex Inc MOLX 0 0 0 0
Materion Corporation MTRN 1,265 1,195 32 2,550
National Instruments Corp NATI 5,413 1,352 152 7,412
Novacopper Inc. NCQ 0 0 0 0
Newmont Goldcorp Corp NEM 31,408 7,834 35 13,700
NOVELL, INC. NOVL 0 0 0 0
Neophotonics Corp NPTN 283 334 -36 1,783
Netgear, Inc NTGR 1,016 827 -5 1,008
Nivalis Therapeutics, Inc. NVLS 38 0 -18 0
Pagerduty, Inc. PD 1,995 9,726 2,671 0
Park Aerospace Corp PKE 330 37 112 387
Pmc Sierra Inc PMCS 0 890 -32 1,442
Pentair Plc PNR 6,447 1,957 285 28,400
Parkervision Inc PRKR 3 0 -16 45
Ptc Inc. PTC 7,549 1,233 -24 5,982
Praxair Inc PX 47,954 12,037 1,500 27,780
Richardson Electronics Ltd RELL 77 163 -8 373
ROHM AND HAAS COMPANY ROH 0 0 0 0
Realpage, Inc RP 5,974 930 42 5,400
Rise Gold Corp. RYES 9 5 0 1
Southern Copper Corp SCCO 26,437 6,990 1,459 13,414
Seachange International Inc SEAC 102 63 -34 286
Sealed Air Corp SEE 6,288 4,720 370 24,000
Sifco Industries Inc SIF 16 112 -13 465
Semiconductor Manufacturing International Corp SMI 24,175 3,360 77 11,385
Surge Components Inc SPRS 17 35 3 38
Stoneridge Inc SRI 888 860 75 4,100
Stillwater Mining Co SWC 0 0 0 1,432
Taitron Components Inc TAIT 16 8 1 20
Tuanche Ltd TC 350 95 -11 700
Te Connectivity Ltd. TEL 31,195 13,260 2,658 72,000
Teradyne, Inc TER 11,017 2,145 470 3,900
Trilogy Metals Inc. TMQ 210,951 -1 30 7
Tower Semiconductor Ltd TSEM 2,259 1,304 133 5,641
Taiwan Semiconductor Manufacturing Co Ltd TSM 257,375 33,697 11,862 45,272
Torotel Inc TTLO 7 22 1 138
Viavi Solutions Inc. VIAV 3,462 1,175 -15 3,500
Versum Materials, Inc. VSM 5,787 1,341 86 1,900
Memc Electronic Materials Inc WFR 0 0 0 0
Xperi Corporation XPER 985 408 28 700
Zoom Telephonics, Inc. ZMTP 16 33 -2 33
SUBTOTAL 1,698,069 449,081 67,297 1,093,263


             
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