Sitime's Suppliers recorded an increase in sales by 8.69 % year on year in Q2 2026, sequentially sales grew by 7.61 %, Sitime recorded an increase in cost of sales by 76.64 % year on year, sequentially cost of sales grew by 26.72 % in Q2.
Sitime's Suppliers recorded an increase in sales by 8.69 % year on year in Q2 2026, sequentially sales grew by 7.61 %, Sitime recorded increase in cost of sales by 76.64 % year on year, sequentially cost of sales grew by 26.72 % in Q2.
The company outsources the manufacturing, assembly, and testing of its semiconductor products to third-party foundries and contractors, focusing internally on design, sales, and marketing. Key foundries and suppliers for MEMS timing devices and analog mixed-signal circuit ICs include Robert Bosch LLC in Germany, Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC) in Taiwan, and Teledyne Digital Imaging Inc. in Canada. Packaging, assembly, and testing are conducted by third-party contractors such as Advanced Semiconductor Engineering, Inc. (ASE) in Taiwan; Carsem (M) Sdn Bhd. in Malaysia; United Test and Assembly Center Ltd. (UTAC) and Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand; Daishinku Corp. in Japan; and STATS ChipPAC Pte Ltd. in Singapore. Finished products are warehoused at outsourced semiconductor assembly and test facilities located in Malaysia, Taiwan, and Thailand. The company maintains a supply agreement with Bosch for MEMS wafer fabrication through February 2027, with automatic renewal provisions. However, it does not hold long-term supply agreements with most other contractors, instead purchasing on a purchase order basis.
Sitime's Comment on Supply Chain
The company outsources the manufacturing, assembly, and testing of its semiconductor products to third-party foundries and contractors, focusing internally on design, sales, and marketing. Key foundries and suppliers for MEMS timing devices and analog mixed-signal circuit ICs include Robert Bosch LLC in Germany, Taiwan Semiconductor Manufacturing Company (TSMC), United Microelectronics Corporation (UMC) in Taiwan, and Teledyne Digital Imaging Inc. in Canada. Packaging, assembly, and testing are conducted by third-party contractors such as Advanced Semiconductor Engineering, Inc. (ASE) in Taiwan; Carsem (M) Sdn Bhd. in Malaysia; United Test and Assembly Center Ltd. (UTAC) and Hana Semiconductor (Ayutthaya) Co., Ltd in Thailand; Daishinku Corp. in Japan; and STATS ChipPAC Pte Ltd. in Singapore. Finished products are warehoused at outsourced semiconductor assembly and test facilities located in Malaysia, Taiwan, and Thailand. The company maintains a supply agreement with Bosch for MEMS wafer fabrication through February 2027, with automatic renewal provisions. However, it does not hold long-term supply agreements with most other contractors, instead purchasing on a purchase order basis.
SITM's Suppliers Net Income grew by
SITM's Suppliers Net margin grew in Q2 to
11.17 %
16.83 %
SITM's Suppliers Net Income grew by 11.17 %
SITM's Suppliers Net margin grew in Q2 to 16.83 %
Sitime's Suppliers Sales Growth
in Q2 2026 by Industry
Sources:
Sitime Corporation's official press releases and regulatory filings; CSIMarket.com's supply-chain research; and the financial filings and press releases of other companies cited in this report.
Updated on:
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