We currently use contract manufacturers to produce the products we sell to our
licensees. Our products are components that are integral to a scanning engine
incorporating our PicoP® scanning technology and include MEMS and ASICs that
incorporate our designs and are produced to order by semiconductor foundries.
The MEMS die that are manufactured by a contract manufacturer are consigned to
a separate contract manufacturer for assembly into a MEMS package according to
our specifications.
Our manufacturing is not currently subject to seasonal variations as our shipments
have been relatively small and are in the early stages of product introduction.
In the future, depending on our customers product mix, we may be affected by
seasonal fluctuations which could affect working capital demands.
We provide forecasts that allow our contract manufacturers to stock component
parts and other materials and plan capacity. Our contract manufacturers procure
raw materials in volumes consistent with our forecasts, manufacture and/or assemble
the products and perform tests according to our specifications. Products are
either shipped to our customers or shipped to our Redmond, Washington headquarters
to be inventoried as finished goods. With the exception of the MEMS die we consign
and retain title to, we generally do not own any raw materials procured by our
contract manufacturers. Title to the products transfers from our contract manufacturers
to us and then to our customers upon shipment from the manufacturer. If raw
materials are unused, or the products are not sold within specified periods
of time, we may incur carrying charges or obsolete material charges for component
parts that our contract manufacturers purchased to build products to meet our
forecasts or customer orders.
Many of the raw materials used in our components are standard to the consumer
electronics industry. Our MEMS, MEMS die, and ASICs are currently manufactured
to our specifications by separate single-source suppliers.
Microvision Inc's Comment on Supply Chain
We currently use contract manufacturers to produce the products we sell to our
licensees. Our products are components that are integral to a scanning engine
incorporating our PicoP® scanning technology and include MEMS and ASICs that
incorporate our designs and are produced to order by semiconductor foundries.
The MEMS die that are manufactured by a contract manufacturer are consigned to
a separate contract manufacturer for assembly into a MEMS package according to
our specifications.
Our manufacturing is not currently subject to seasonal variations as our shipments
have been relatively small and are in the early stages of product introduction.
In the future, depending on our customers product mix, we may be affected by
seasonal fluctuations which could affect working capital demands.
We provide forecasts that allow our contract manufacturers to stock component
parts and other materials and plan capacity. Our contract manufacturers procure
raw materials in volumes consistent with our forecasts, manufacture and/or assemble
the products and perform tests according to our specifications. Products are
either shipped to our customers or shipped to our Redmond, Washington headquarters
to be inventoried as finished goods. With the exception of the MEMS die we consign
and retain title to, we generally do not own any raw materials procured by our
contract manufacturers. Title to the products transfers from our contract manufacturers
to us and then to our customers upon shipment from the manufacturer. If raw
materials are unused, or the products are not sold within specified periods
of time, we may incur carrying charges or obsolete material charges for component
parts that our contract manufacturers purchased to build products to meet our
forecasts or customer orders.
Many of the raw materials used in our components are standard to the consumer
electronics industry. Our MEMS, MEMS die, and ASICs are currently manufactured
to our specifications by separate single-source suppliers.
Sources:
Microvision Inc 's official press releases and regulatory filings; CSIMarket.com's supply-chain research; and the financial filings and press releases of other companies cited in this report.
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