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Himax Technologies Inc   (NASDAQ: HIMX)
    Sector • Technology    Industry • Semiconductors
   Industry • Semiconductors
   Sector • Technology
 

Himax Technologies Inc's Suppliers Performance

HIMX's Supply Chain



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HIMX Costs vs Sales of Suppliers Growth

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Himax Technologies Inc's Comment on Supply Chain


The company utilizes third-party semiconductor manufacturing service providers for wafer fabrication, gold bumping, assembly, and testing. It employs foundries with high-voltage CMOS process technology for display drivers and assembly/testing facilities specializing in Tape Automated Bonding (TAB) and Chip on Glass (COG) packages. The company also relies on third-party suppliers for processed tape used in TAB packaging. The company operates a fabrication facility under Himax Display for Liquid Crystal on Silicon (LCoS) microdisplays and maintains an in-house wafer level optics (WLO) facility under Himax Taiwan. Construction of Fab 2 began in 2017 to expand WLO capacity and support the 3D sensing business, with completion in 2018. Manufacturing stages include wafer fabrication by foundries, gold bumping by specialized houses, chip probe testing, and assembly/testing using TAB or COG technologies. TAB assembly involves Tape Carrier Package (TCP) and Chip on Film (COF) packages made from processed tape plated with copper foil.

Himax Technologies Inc's Comment on Supply Chain


The company utilizes third-party semiconductor manufacturing service providers for wafer fabrication, gold bumping, assembly, and testing. It employs foundries with high-voltage CMOS process technology for display drivers and assembly/testing facilities specializing in Tape Automated Bonding (TAB) and Chip on Glass (COG) packages. The company also relies on third-party suppliers for processed tape used in TAB packaging. The company operates a fabrication facility under Himax Display for Liquid Crystal on Silicon (LCoS) microdisplays and maintains an in-house wafer level optics (WLO) facility under Himax Taiwan. Construction of Fab 2 began in 2017 to expand WLO capacity and support the 3D sensing business, with completion in 2018. Manufacturing stages include wafer fabrication by foundries, gold bumping by specialized houses, chip probe testing, and assembly/testing using TAB or COG technologies. TAB assembly involves Tape Carrier Package (TCP) and Chip on Film (COF) packages made from processed tape plated with copper foil.







HIMX's vs. Suppliers, Data

(Revenue and Income for Trailing 12 Months, in Millions of $, except Employees)



COMPANY NAME MARKET CAP REVENUES INCOME EMPLOYEES
Himax Technologies Inc 2,568.27 832.17 45.28 202
SUBTOTAL 0.00 0.00 0.00 -


Sources: Himax Technologies Inc 's official press releases and regulatory filings; CSIMarket.com's supply-chain research; and the financial filings and press releases of other companies cited in this report.
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