Power Integrations Inc's Suppliers recorded an increase in sales by 10.59 % year on year in Q2 2026, sequentially sales grew by 6.59 %, Power Integrations Inc recorded an increase in cost of sales by 4.63 % year on year, sequentially cost of sales grew by 5.71 % in Q2.
Power Integrations Inc's Suppliers recorded an increase in sales by 10.59 % year on year in Q2 2026, sequentially sales grew by 6.59 %, Power Integrations Inc recorded increase in cost of sales by 4.63 % year on year, sequentially cost of sales grew by 5.71 % in Q2.
The company sources silicon wafers primarily from three foundries: Lapis Semiconductor Co., Ltd. (formerly OKI Electric Industry), Seiko Epson Corporation, and X-FAB Semiconductor Foundries AG. These foundries produce wafers using proprietary high-voltage process technologies at facilities located in Japan, Germany, and the United States. The company's integrated circuits (ICs) are assembled, packaged, and tested by independent subcontractors in China, Malaysia, Thailand, and the Philippines, with some testing conducted at the company's headquarters in California. Gate-driver boards are assembled and tested by subcontractors in Sri Lanka and Thailand, with additional testing performed in Switzerland. Operating under a fabless manufacturing model, the company requires assembly manufacturers to use high-voltage molding compounds specific to its products.
Wafer supply agreements with Lapis Semiconductor, Seiko Epson Corporation, and X-FAB Semiconductor Foundries expire in December 2028, December 2035, and December 2028, respectively. These agreements include reserved production capacity, fixed prices subject to periodic review, and require rolling six-month forecasts. Purchases from these suppliers are denominated in U.S. dollars, with currency exchange risk shared for agreements with Lapis and Epson. Typical lead times for wafer shipments range from four to six weeks, with longer lead times for new products. The company maintains substantial wafer and finished-goods inventory to manage fluctuations in demand.
Power Integrations Inc's Comment on Supply Chain
The company sources silicon wafers primarily from three foundries: Lapis Semiconductor Co., Ltd. (formerly OKI Electric Industry), Seiko Epson Corporation, and X-FAB Semiconductor Foundries AG. These foundries produce wafers using proprietary high-voltage process technologies at facilities located in Japan, Germany, and the United States. The company's integrated circuits (ICs) are assembled, packaged, and tested by independent subcontractors in China, Malaysia, Thailand, and the Philippines, with some testing conducted at the company's headquarters in California. Gate-driver boards are assembled and tested by subcontractors in Sri Lanka and Thailand, with additional testing performed in Switzerland. Operating under a fabless manufacturing model, the company requires assembly manufacturers to use high-voltage molding compounds specific to its products.
Wafer supply agreements with Lapis Semiconductor, Seiko Epson Corporation, and X-FAB Semiconductor Foundries expire in December 2028, December 2035, and December 2028, respectively. These agreements include reserved production capacity, fixed prices subject to periodic review, and require rolling six-month forecasts. Purchases from these suppliers are denominated in U.S. dollars, with currency exchange risk shared for agreements with Lapis and Epson. Typical lead times for wafer shipments range from four to six weeks, with longer lead times for new products. The company maintains substantial wafer and finished-goods inventory to manage fluctuations in demand.
POWI's Suppliers Net Income grew by
POWI's Suppliers Net margin grew in Q2 to
23.12 %
22.04 %
POWI's Suppliers Net Income grew by 23.12 %
POWI's Suppliers Net margin grew in Q2 to 22.04 %
Power Integrations Inc's Suppliers Sales Growth
in Q2 2026 by Industry
Sources:
Power Integrations Inc 's official press releases and regulatory filings; CSIMarket.com's supply-chain research; and the financial filings and press releases of other companies cited in this report.
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