We are working to establish CyberOptics as a global leader in high precision
3D sensors. Our objective is to deliver profitable growth by leveraging our
3D technologies in our key vertical markets of surface mount technology (SMT),
semiconductor and 3D scanning solutions and services.
Our products and services are used in the SMT, semiconductor and 3D scanning
solutions and services markets to significantly improve our customers manufacturing
yields and productivity, and to assist our customers in meeting their rigorous
demands for manufacturing quality. Our products use a variety of proprietary
technologies such as lasers, optics and machine vision, combined with software,
electronics and mechanical design. Our SMT and semiconductor products enable
manufacturers to increase production volume, product yields and quality by measuring
the characteristics and placement of electronic components and semiconductor
packages both during and after the assembly process, or by providing SMT electronic
circuit board and semiconductor manufacturers with key metrics related to their
manufacturing processes that allow them to improve production volumes and yields.
Our 3D scanning solutions and services help manufacturers quickly solve their
most complex 3D inspection, analysis and product engineering challenges, allowing
them to improve product yields and quality.
The majority of our products (60% of revenue in 2015) are developed and sold
for use in SMT electronic circuit board assembly or with equipment used in SMT
electronic circuit board assembly. We sell products in these markets both as
sensor components that are incorporated into products manufactured by other
companies for sale to circuit board assembly companies, and as complete stand-alone
inspection systems that are sold directly to circuit board assembly companies.
We manufacture 3D and 2D optical sensors for use in our own proprietary SMT
inspection systems and for sale to original equipment manufacturers (OEMs) in
our key vertical markets and adjacent markets. Our SMT electronic assembly alignment
sensor products are sold to manufacturers of pick-and-place machines to align
electronic surface mount components during placement on the circuit board and
to a solder paste screen printer company to align stencils with circuit boards.
We also sell sensors to OEMs for solder paste inspection (SPI) systems, and
more recently, high precision 3D sensors to KLA-Tencor for use in systems that
inspect back-end semiconductor packaging.
Our SMT inspection system products are sold to electronic manufacturing services
(EMS) companies and other manufacturers of SMT electronic circuit boards to
control quality as in-line systems. These products are used by manufacturers
to measure screen printed solder paste, to inspect circuit boards and components
after component placement, to confirm proper placement after full assembly of
circuit boards and to inspect solder joints on printed circuit boards. Manufacturers
of DRAM and Flash Memory also use our inspection system products to inspect
assembly of their memory modules both before and after module singulation.
Our semiconductor products assist with yield improvement and tool uptime in
the semiconductor wafer fabrication process by providing highly accurate measurements
of critical process factors. These measurements are impossible or very difficult
to obtain without powering down the wafer fabrication equipment. Customers who
use our products have better yields, through-put and tool up-time. Our products
are more accurate when compared to the various manual techniques historically
used by semiconductor manufacturers to obtain critical wafer fabrication process
measurements.
Our 3D scanning solutions capture surface data for product engineering and
inspection. Our 3D scanning services scan, model and inspect objects of all
sizes and complexity for customers who do not have their own general purpose
metrology equipment.
We develop, manufacture and sell intelligent, non-contact sensors and systems
for process control and inspection and, through LDI, for metrology applications
and services. Our product offerings are sold to OEMs and end-user customers
in the SMT circuit board assembly and semiconductor industries. Our OEMs incorporate
our sensor offerings into capital equipment serving these industries. We also
sell sensors and stand-alone inspection systems directly to end-users. We create
value-added products by integrating LDIs proprietary software with sensors
and other hardware purchased from third parties, and sell these products and
complete metrology systems manufactured by third parties for use to create detailed,
3D digital maps of objects. These 3D digital images are used in manufacturing,
3D printing, and similar applications. Through LDI, we also provide services
for 3D mapping for those customers who cannot justify the capital cost of a
scanning project, or need services for special projects.
Our principal products are used by manufacturers to increase operating efficiencies
and yields, and to assist them in meeting rigorous demands for product quality.
In addition to proprietary hardware designs that combine precision optics, various
light sources and multiple detectors, our products incorporate software that
controls the hardware and filters and converts raw data into application specific
information. Our 3D scanning solutions and services help manufacturers quickly
solve their most complex 3D inspection, analysis and product engineering challenges,
allowing them to improve product yields and quality.
We differentiate our products primarily on the basis of customer benefits afforded
by the use of innovative and proprietary technology and on our ability to combine
several different technical disciplines to address industry and customer needs.
In addition, we actively seek ongoing strategic customer relationships with
leading product innovators in both our existing and new markets. We actively
investigate the needs of, and seek input from, these customers to ensure adoption
of current technologies and to identify opportunities to improve manufacturing
processes.
%