We are a leader in the design, engineering and manufacturing of critical fluid
delivery subsystems and components for semiconductor capital equipment. Our
product offerings include gas and chemical delivery subsystems, collectively
known as fluid delivery subsystems, which are key elements of the process tools
used in the manufacturing of semiconductor devices. Our gas delivery subsystems
deliver, monitor and control precise quantities of the specialized gases used
in semiconductor manufacturing processes such as etch and deposition. Our chemical
delivery subsystems precisely blend and dispense the reactive liquid chemistries
used in semiconductor manufacturing processes such as chemical-mechanical planarization,
electroplating, and cleaning. We also manufacture precision machined components,
weldments, and proprietary products for use in fluid delivery systems for direct
sales to our customers. This vertically integrated portion of our business is
primarily focused on metal and plastic parts that are used in gas and chemical
systems, respectively.
Fluid delivery subsystems ensure accurate measurement and uniform delivery
of specialty gases and chemicals at critical steps in the semiconductor manufacturing
processes. Any malfunction or material degradation in fluid delivery reduces
yields and increases the likelihood of manufacturing defects in these processes.
Historically, semiconductor original equipment manufacturers, or OEMs, internally
designed and manufactured the fluid delivery subsystems used in their process
tools. Currently, most OEMs outsource all or a portion of the design, engineering
and manufacturing of their gas delivery subsystems to a few specialized suppliers,
including us. Additionally, many OEMs are also increasingly outsourcing the
design, engineering and manufacturing of their chemical delivery subsystems
due to the increased fluid expertise required to manufacture these subsystems.
Outsourcing these subsystems has allowed OEMs to leverage the suppliers’
highly specialized engineering, design and production skills while focusing
their internal resources on their own value-added processes. We believe that
this outsourcing trend has enabled OEMs to reduce their fixed costs and development
time, as well as provided significant growth opportunities for specialized subsystems
suppliers like us.
Our goal is to be a leading supplier of outsourced fluid delivery subsystems
and components to OEMs engaged in manufacturing capital equipment to produce
semiconductors and to leverage our technology to expand our addressable markets.
To achieve this goal, we engage with our customers early in their design and
development processes and utilize our deep engineering resources and operating
expertise to jointly create innovative and advanced solutions that meet the
current and future needs of our customers. These collaborations frequently involve
our engineers working at our customers’ sites and serving as an extension
of our customers’ product design teams. We employ this approach with two
of the largest manufacturers of semiconductor capital equipment in the world.
We believe this approach enables us to design subsystems that meet the precise
specifications our customers demand, allows us to often be the sole supplier
of these subsystems during the initial production ramp and positions us to be
the preferred supplier for the full five to ten-year lifespan of the process
tool.
The broad technical expertise of our engineering team, coupled with our early
customer engagement approach, enables us to offer innovative and reliable solutions
to complex fluid delivery challenges. With two decades of experience developing
complex fluid delivery subsystems and meeting the constantly changing production
requirements of leading semiconductor OEMs, we have developed expertise in fluid
delivery that we offer to our OEM customers. In addition, our capital efficient
model and the integration of our business systems with those of our customers
provides us the flexibility to fulfill increased demand and meet changing customer
requirements with relatively low levels of capital expenditures. With an aim
to superior customer service, we have a global footprint with many facilities
strategically located in close proximity to our customers.
Gas Delivery Subsystems
Gas delivery is among the most technologically complex functions in semiconductor
capital equipment and is used to deliver, monitor and control precise quantities
of the vapors and gases critical to the manufacturing process. Our gas delivery
systems consist of a number of gas lines, each controlled by a series of mass
flow controllers, regulators, pressure transducers and valves, and an integrated
electronic control system. Our gas delivery subsystems are primarily used in
equipment for “dry” manufacturing processes, such as etch, chemical
vapor deposition, physical vapor deposition, epitaxy and strip.
Chemical Delivery Subsystems
Our chemical delivery subsystems are used to precisely blend and dispense reactive
chemistries and colloidal slurries critical to the specific “wet”
front-end process, such as wet clean, electro chemical deposition (“ECD”),
and chemical-mechanical planarization (“CMP”). In addition to the
chemical delivery subsystem, we also develop the process modules that apply
the various chemicals directly to the wafer in a process and application-unique
manner to create the desired chemical reaction.
Weldments
Our complete offering of weldments support the delivery of fluids through the
process tool. We have developed both automated and manual welding process to
support world class workmanship on all types of metals needed to support fluid
delivery within the semiconductor market. The welded assemblies are used in
both wet and dry processes.
Precision Machining
Precision machining provides the ability to supply our customers with components
used in our gas delivery systems and weldments, while also providing custom
machined solutions throughout customers’ equipment. Many of these items
are used downstream of the gas system and in process critical applications.
Our precision machined products can be used in both wet and dry applications.
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