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Onto Innovation Inc   (ONTO)
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Price: $175.7400 $0.31 0.177%
Day's High: $180.6197 Week Perf: -3.89 %
Day's Low: $ 173.46 30 Day Perf: -0.41 %
Volume (M): 419 52 Wk High: $ 199.72
Volume (M$): $ 73,565 52 Wk Avg: $125.86
Open: $177.76 52 Wk Low: $76.40



 Market Capitalization (Millions $) 8,682
 Shares Outstanding (Millions) 49
 Employees 1,636
 Revenues (TTM) (Millions $) 850
 Net Income (TTM) (Millions $) 157
 Cash Flow (TTM) (Millions $) 6
 Capital Exp. (TTM) (Millions $) 29

Onto Innovation Inc
Onto Innovation is a global leader in the design, development, manufacture, and support of semiconductor industry metrology and inspection tools, such as process control tools that perform optical metrology on patterned and unpatterned wafers, wafer macro-defect inspection, including macro-inspection of both 2D and 3D wafer features, wafer substrate and panel substrate lithography systems, and process control analytical software. Our goods are largely employed in the semiconductor sector by silicon wafer producers, semiconductor device fabricators, and advanced packaging makers. Our products are also used for process control in a variety of other specialty device manufacturing markets, such as light-emitting diodes ("LED"), vertical-cavity surface-emitting lasers ("VCSEL"), micro-electromechanical systems ("MEMS"), CMOS image sensors ("CIS"), silicon and compound semiconductor (SiC and GaN) power devices, analog devices, and radio frequency (RF) devices.

We provide process and yield management solutions used in bare silicon wafer production and wafer processing facilities, often referred to as 'front-end' manufacturing, and advanced packaging of chips and test facilities, or 'back-end' manufacturing, through a portfolio of standalone systems for optical metrology, macro-defect inspection, packaging lithography, as well as transparent and opaque thin film measurements. Our automated and integrated metrology systems measure critical dimensions, device structures, topography, shape, and various thin film compositions, including three-dimensional features and film thickness, as well as optical, electrical and material properties. Our primary areas of focus include products that provide critical yield-enhancing and actionable information, which is used by microelectronic device manufacturers to improve yield and time to market of their next-generation devices. Our systems feature sophisticated software and production-worthy automation. In addition, our advanced process control software portfolio includes powerful solutions for standalone tools, groups of tools, and factory-wide and enterprise-wide suites to enhance productivity and achieve significant cost savings. Our systems are backed by worldwide customer service and applications support.
Our metrology systems and software are primarily used for controlling certain manufacturing processes utilized in the production of advanced, or leading-edge, wafer designs. The shrinking of features such as the constituents that form a single transistor are known as node reductions. The numeric identification of a specific node usually refers to a dimension associated with one of the transistor's constituents. Advanced nodes are associated with transistor dimensions less than 16nm. Our metrology systems used to measure and characterize these small features are generally purchased when a customer is beginning to manufacture at a new, smaller node, in order to set up and test new manufacturing equipment being installed for the new node. Our process control/metrology equipment is generally installed prior to the installation of the actual process equipment for that reason. Additional process control equipment is normally purchased when the initial process yields have been stabilized and more manufacturing capacity is required to meet production demands. Therefore, our sales to customers for advanced nodes is generally higher when manufacturing lines for new nodes are being established and may not represent continuous sales revenue until our initial systems reach high levels of utilization driven by the need for greater capacity. In 2022 several top semiconductor manufacturers entered pilot production at a 3nm node using our Atlas' V products.
Our inspection systems, lithography systems, and software are primarily used for processing and inspecting advanced packaging associated with back-end manufacturing. Advanced packaging techniques comprise a very wide variety of assembly methods in order to connect individual chips to a larger printed circuit ('PC') board, or connecting a group of chips together to form a 'system in a package' ('SIP'), also known as heterogeneous integration ('HI'), or chiplets. Many of these advanced packages require lithographic imaging to produce copper interconnections between the chip and the PC Board or between chips in the case of SIP or HI advanced packages. Our inspection systems and software are used for process control and detection of potential reliability failures in nearly all of these packages. Unlike the cyclical nature of our metrology equipment associated with node shrinks, our sales revenue for advanced packaging is generally driven by assembly volumes. Inspection rates for advanced packages are high throughout the assembly process to avoid a single defective chip from being assembled into a relatively expensive package, making the inspection process control systems attach rates quite linear with production volumes of these devices.
Several macro-drivers continue to drive demand for sophisticated metrology and inspection systems. In 2020, a significant portion of the global workforce began working from home as part of corporate efforts to isolate and protect workers from COVID-19. This transition resulted in extremely high usage of data centers and cloud processing that drove higher demand for increased memory and HPC devices. In 2021, wireless 5G networks drove demand for new 5G phones and that demand continued in the first half of 2022 as new phones from Apple and Samsung were introduced to the market. The building of the 5G network over the next several years will also bring more machine-to-machine communications. In addition, the rise of electric vehicles and other industrial technologies is creating an increase in demand for power semiconductors. And semiconductor manufacturers are increasingly developing chiplets that include a series of smaller die rather than one larger monolithic die. These macro-drivers are increasing the need for high-performance semiconductors and advanced packaging, which are then driving the demand for sophisticated metrology and inspection systems in order to achieve the semiconductor performance required while achieving a profitable manufacturing yield.
Advanced Nodes. 'Advanced Nodes' refers to leading-edge integrated circuits where the feature sizes of transistors and other features continue to shrink in specified steps, or nodes measured in nanometers (nm). Demand for our products continues to be driven by our customers desire for higher overall chip performance without increasing the chip size, while improving power efficiency, logic processing capability, data storage volume and manufacturing yield. To achieve these goals, our customers have increased their use of more complex materials and processing methods in their manufacturing flow. The primary paths for performance gains are geometric scaling, known as node shrinks, or scaling of transistor dimensions. In some cases, our customers are implementing new materials and methods in high volume manufacturing, including materials and device architectures to reduce power consumption, and stacked devices. To scale NAND memory, a 3D stacking architecture has been implemented at several customers with more than 150 storage cell layers for devices in production. Additional innovation continues in Data Storage, Power Devices, MEMS, and Image Sensors. We believe the use of these new materials and manufacturing methods has increased demand for our products such as the Atlas' product line that is capable of measuring these advanced nodes as certain features shrink beyond 7nm, to 5nm, 3nm and in the most advanced of cases, 2 nm.
One current process to manufacture advanced packaging involves attaching known good die to a 300mm wafer, used as a temporary carrier when adding components such as RDLs and copper pillars. SIP packages can often contain side-by-side die, meaning the package can be large and limit the number of packages being placed on a reconstituted wafer. In order to meet the growing demand at reduced average selling prices, manufacturers are looking to scalable technology. Advanced packaging facilities looking to improve Cost of Ownership and increase productivity are transitioning from 300mm wafers to large rectangular panels, which can be as large as 600mm x 600mm. This larger size enables companies manufacturing large area packages to increase the number of devices being processed at each step as they are no longer limited to operating within the constraints of a round wafer. By responding to market opportunities and addressing the stringent demands of customers' technical roadmaps, we believe that Onto Innovation is optimally positioned to capitalize on the emerging market of high-volume manufacturing of advanced IC substrates. For example, the JetStep' X500 lithography system, having emerged from the flat panel display market, is readily capable of processing RDLs on very thin advanced organic laminate panels in the semiconductor advanced packaging market. The Firefly' series of panel level macro inspection tools, designed for high resolution inspection, can provide defect detection and location information to the JetStep X500 tool for each die, which greatly improves lithography throughput using our exclusive StepFAST' process. It also delivers a combination of defect classification and process throughput in a single software platform. It reduces capital investment requirements and provides a reliable pathway to transition from wafer to panel-based processes.


   Company Address: 16 Jonspin Road Wilmington 1887 MA
   Company Phone Number: 253-6200   Stock Exchange / Ticker: NYSE ONTO
   


Customers Net Income fell by ONTO's Customers Net Profit Margin fell to

-9.86 %

19.13 %

• Customers Performance • Customers Expend. • Customers Efficiency • List of Customers


   

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Management Changes

Onto Innovation Appoints Financial Expert Susan Lynch to Board of Directors, Reports Strong Q3 Performance and Promising Growth

Published Mon, Mar 18 2024 11:00 AM UTC

Onto Innovation Welcomes Susan Lynch to its Board of Directors
Onto Innovation Inc. recently announced the addition of Susan Lynch to its board of directors. With an impressive background in financial leadership and over 30 years of experience in high technology companies, Lynch brings a wealth of knowledge and expertise to Onto Innovation.
Lynch most recently served...

Product Service News

Onto Innovations' 4Di InSpec System Wins FANUC Innovative System of the Year Award

Published Mon, Feb 26 2024 12:30 PM UTC

Onto Innovation Inc. (NYSE: ONTO) and its subsidiary, 4D Technology, have been recognized for their groundbreaking 4Di InSpec automated metrology system (AMS) by winning the prestigious 2024 Innovative System of the Year award from FANUC America. This award underscores the system's ability to revolutionize automated surface defect and feature metrology across multiple indust...

Product Service News

Onto Innovation Introduces Firefly G3 Amid Fluctuating Financial Performances

Published Tue, Jan 16 2024 1:25 PM UTC

Onto Innovation Inc., a Massachusetts-based company listed on NYSE, has recently introduced the Firefly G3, an inspection and metrology system for automated process control during high volume production of panel-level substrates. Initially shipped to a tier one customer, the Firefly G3 is designed for use with a range of AI chiplet based panel-level packages, with additional...

Onto Innovation Inc

Onto Innovation Inc Struggles Amidst a Harsh Business Climate with an Unexpected -18.514% Revenue Drop in Q3 2023



Onto Innovation Inc, a Scientific & Technical Instruments company, recently released its financial results for the three-month period ending on September 30, 2023. The report indicates a decline in both revenue and net profit per share compared to the same period last year. However, there are signs of improvement when comparing the results with the preceding quarter. This article aims to interpret the financial results and discuss how they may impact Onto Innovation Inc going forward.
Soft Top and Bottom Line:
Onto Innovation Inc reported a -18.514% decrease in revenue, from $253.85 million to $206.85 million, when comparing the third quarter of 2023 with the same period in the previous year. Similarly, the net profit per share dropped by -30.48% from $1.05 to $0.73. These figures suggest a challenging market environment for the company during this period.

Onto Innovation Inc

Onto Innovation Inc Faces Sharp Decline in Revenue in Latest Fiscal Period

Onto Innovation Inc, formerly known as Nanometrics Incorporated, is a California-based company specializing in the development and manufacturing of advanced process control solutions for the semiconductor and other related industries. The company boasts a diverse portfolio of products that enable its customers to achieve better yields and device performance, while also reducing costs and shortening development cycles.
In the first quarter of 2023, Onto Innovation Inc reported a decline in both its top and bottom line. Its revenue decreased by 11.735% year-on-year to $199.17 million, while its earnings per share dropped by 37.04% to $0.59 compared to $0.94 in the same period the year before. This was a significant drop from the previous quarter, where profit plummeted by -55.96% from $1.34 per share and revenue fell by -21.363% from $253.27 million.






 

Onto Innovation Inc's Segments
 
 
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